This course introduces concepts in the boiling and evaporation enhancement for electronics cooling utilizing micro/nanostructured surface modifications. Innovative methods for heat dissipation from microelectronics devices, including IGBT, GPU/CPU and assessment of these techniques over a range of applications and scales, will be covered. Phase change heat transfer enhancement in microchannels and micro surfaces will be introduced and discussed. Some special emphasis is given to industry applications to discuss current electronics cooling trends.